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Package Design Engineer - Semiconductor
CA - Irvine
About Us
Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”
Are you interested in playing a critical, impactful role and working with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.
Role Summary and Purpose
- Interfacing between Design, Product Development, Operations Teams and OSAT (Outsourced Semiconductor Assembly and Test) foundry
- Supporting New Product Introduction activities (NPI) through phase gate
Essential Responsibilities
- Work with Design team to define the package requirements
- Review and approve package outline drawings, substrate drawings and BOMs
- Create and maintain procedures to oversee NPI and Operations programs
- Establish and maintain regular program updates and status reporting
- Develop and implement processes with Design team to ensure design-for-manufacturing elements are included as an integral element of the new product definition effort
- Work with OSAT in new and improving assembly process, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of new assembly process
Qualifications and Requirements
- Bachelor’s degree in Engineering
- Minimum 5 years’ experience in semiconductor packaging technology
- Knowledge of various assembly processes: WLCSP, Flip Chip, SIP and organic laminate technologies
- Experience in AutoCad, thermal and mechanical modeling
About Us
Menlo Micro has reinvented one of the most fundamental building blocks of electronic systems – the electronic switch. Menlo Micro’s technology creates a new switch category that eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds with its “Ideal Switch.”
Are you interested in playing a critical, impactful role and working with top electronic systems talent at an exciting startup backed by industry leaders? Do you want to help create truly disruptive and unique products that have the ability to change markets? If you answered yes to both, this may be your opportunity to have a significant impact at a cutting-edge startup with industry-leading technology that will drive electronic systems innovation across a diverse range of industries.
Role Summary and Purpose
- Interfacing between Design, Product Development, Operations Teams and OSAT (Outsourced Semiconductor Assembly and Test) foundry
- Supporting New Product Introduction activities (NPI) through phase gate
Essential Responsibilities
- Work with Design team to define the package requirements
- Review and approve package outline drawings, substrate drawings and BOMs
- Create and maintain procedures to oversee NPI and Operations programs
- Establish and maintain regular program updates and status reporting
- Develop and implement processes with Design team to ensure design-for-manufacturing elements are included as an integral element of the new product definition effort
- Work with OSAT in new and improving assembly process, running process DOE’s, identifying new materials and equipment, reliability testing, and qualification of new assembly process
Qualifications and Requirements
- Bachelor’s degree in Engineering
- Minimum 5 years’ experience in semiconductor packaging technology
- Knowledge of various assembly processes: WLCSP, Flip Chip, SIP and organic laminate technologies
- Experience in AutoCad, thermal and mechanical modeling
